VisionGauge^® OnLine is used in the automatic presence detection of epoxy under-fill between a high-density circuit and its substrate, during the assembly process. VisionGauge^® OnLine also measures the under-fill's "footprint" (i.e. maximum dimensions along the X and Y axes). This is carried out in-process, right after the dispensing and placement operations.

 

 

 

 

 

View more information about our wire bond inspection and measurement solutions.

 

 

VisionGauge^® is central to our new wide-field-of-view, high-resolution measurement systems. These systems use specialized long-working-distance telecentric optics to produce very crisp & clear imagery with extremely low distortion. Different configurations are available with field-of-views as wide as 4.5" (approx. 115 mm). Furthermore, these systems include a high-resolution digital color camera and are capable of resolutions as fine as 0.001" (approx. 25 microns).

These systems also include X-Y-Theta positioning mechanisms for quick & easy part alignment. These measurement systems come with both transmitted & reflected illumination.

And these systems support all of the measurement tools and functionality of the Standard Edition of the VisionGauge^® software package.

These high-accuracy inspection and measurement systems are ideal for low volume inspection, measurement and documentation of parts measuring a few inches.